BIWIN announces the debut of its advanced Industrial BGA SSD, a flagship storage innovation engineered for the rapidly evolving AIoT and edge intelligence landscape.
This new-generation BGA SSD merges ultra-compact design with outstanding computing efficiency, offering up to 1 TB capacity and PCIe Gen4x4 performance in a miniature 16.0 × 20.0 × 1.3 mm footprint. Built for mission-critical devices, the SSD ensures low latency, high endurance, and reliable operation under extreme industrial and automotive conditions.
With wide-temperature support ranging from -40°C to 105°C, self-developed firmware, advanced LDPC error correction, and ultra-fast boot algorithms, the BIWIN Industrial BGA SSD is optimised for smart vehicles, industrial control, AI smart boxes, high-load edge computing devices, and next-generation autonomous systems.
Its compact BGA packaging significantly reduces PCB footprint—offering a 94.09% volume reduction compared to standard 2280 SSDs—while delivering superior power efficiency and long-term durability in harsh operating environments.






Discussion about this post